论文题目：Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature
论文作者：Mengyan Wang, Quan Zhang, Yiwen Bo, Chunyang Zhang, Yiwen Lv,
Xiang Fu, Wen He, Xiangqian Fan, Jiajie Liang, Yi Huang, Rujun Ma*, Yongsheng Chen
Abstract：
With practical interest in the future applications of next-generation electronic devices, it is imperative to develop new conductive interconnecting materials appropriate for modern electronic devices to replace traditional rigid solder tin and silver paste of high melting temperature or corrosive solvent requirements. Herein, we design highly stretchable shape memory self-soldering conductive (SMSC) tape with reversible adhesion switched by temperature, which is composed of silver particles encapsulated by shape memory property and anti-fatigue ability even under the strain of 90%. It also exhibits an initial conductivity of 2772 S cm(-1) and a maximum tensile strain of similar to 100%. The maximum conductivity could be increased to 5446 S cm(-1) by decreasing the strain to 17%. Meanwhile, SMSC tape can easily realize a heating induced reversible strong-to-weak adhesion transition for self-soldering circuit. The combination of stable conductivity, excellent shape memory performance, and temperature-switching reversible adhesion enables SMSC tape to serve two functions of electrode and solder simultaneously. This provides a new way for conductive interconnecting materials to meet requirements of modern electronic devices in the future.
